HENGJINDA, P. A Detailed Analysis of Wafer Scale Integration and Multichip Modules. Recent Research Reviews Journal, [S. l.], v. 1, n. 1, p. 75–86, 2022. DOI: 10.36548/rrrj.2022.1.007. Disponível em: https://irojournals.com/rrrj/article/view/1833. Acesso em: 26 mar. 2026.