Abstract
The rapid evolution of wireless communication systems calls for ever-increasing data rate, reduced latency, enhanced spectral efficiency and dependable connectivity of many mobile devices. The transition from fifth generation (5G) communication systems to sixth generation (6G) necessitates advancements in semiconductor technology and novel approaches in communication. This paper reviews some of the semiconductor materials and optical wireless communication systems suitable for future communications systems. Some of the semiconductor materials that can be used in future communication systems include silicon (Si), silicon-germanium (SiGe), gallium nitride (GaN), gallium arsenide (GaAs), and indium phosphide (InP). These materials have been selected for this study considering their suitability in applications of high frequency and power. Also, emerging materials and future devices are considered in the discussion. Optical wireless communication technologies reviewed in this paper include visible light communication (VLC), light fidelity (LiFi), and free-space optical (FSO) communication technologies. Future communication technologies face several challenges including device scaling, heat dissipation, and complex systems integration. This paper also addresses possible future research areas for future communication systems including hybrid radio frequency-optical networks and intelligent communication systems.
References
- Ozaki, Shiro, Takuichi Hirano, Naoya Okamoto, Yasuhiro Nakasha, Toshihiro Ohki, and Naoki Hara. “Heterogeneous Integration for Sub-THz Antenna Array with InP-Based Power Amplifiers.” In 2024 IEEE Conference on Antenna Measurements and Applications (CAMA), 2024, 1–4.
- Haas, Harald, Liang Yin, Yunlu Wang, and Cheng Chen. “What Is LiFi?” Journal of Lightwave Technology 2015, vol. 34, no. 6, 1533–1544.
- Ghassemlooy, Zabih, Wasiu Popoola, and Sujan Rajbhandari. Optical Wireless Communications: System and Channel Modelling with Matlab®. Boca Raton: CRC Press, 2019.
- Chowdhury, Mostafa Zaman, Moh Khalid Hasan, Md Shahjalal, Md Tanvir Hossan, and Yeong Min Jang. “Optical Wireless Hybrid Networks: Trends, Opportunities, Challenges, and Research Directions.” IEEE Communications Surveys & Tutorials 2020, vol. 22, no. 2, 930–966.
- Rappaport, Theodore S., Yunchou Xing, Ojas Kanhere, Shihao Ju, Arjuna Madanayake, Soumyajit Mandal, Ahmed Alkhateeb, and Georgios C. Trichopoulos. “Wireless Communications and Applications Above 100 GHz: Opportunities and Challenges for 6G and Beyond.” IEEE Access 2019, vol. 7, 78729–78757.
- Hirata, Akihiko, Toshihiko Kosugi, Hiroyuki Takahashi, Jun Takeuchi, Hiroyoshi Togo, Makoto Yaita, Naoya Kukutsu et al. “120-GHz-Band Wireless Link Technologies for Outdoor 10-Gbit/s Data Transmission.” IEEE Transactions on Microwave Theory and Techniques 2012, vol. 60, no. 3, 881–895.
- Zimmer, Thomas, Josef Böck, Fred Buchali, Pascal Chevalier, Michael Collisi, Björn Debaillie, Marina Deng et al. “SiGe HBTs and BiCMOS Technology for Present and Future Millimeter-Wave Systems.” IEEE Journal of Microwaves 2021, vol. 1, no. 1, 288–298.
- Mishra, Umesh K., Primit Parikh, and Yi-Feng Wu. “AlGaN/GaN HEMTs—An Overview of Device Operation and Applications.” Proceedings of the IEEE 2002, vol. 90, no. 6, 1022–1031.
- Schwierz, Frank. “Graphene Transistors.” Nature Nanotechnology 2010, vol. 5, no. 7, 487–496.
- Wang, Qing Hua, Kourosh Kalantar-Zadeh, Andras Kis, Jonathan N. Coleman, and Michael S. Strano. “Electronics and Optoelectronics of Two-Dimensional Transition Metal Dichalcogenides.” Nature Nanotechnology 2012, vol. 7, no. 11, 699–712.
- Urteaga, Miguel, Zach Griffith, Munkyo Seo, Jonathan Hacker, and Mark J. W. Rodwell. “InP HBT Technologies for THz Integrated Circuits.” Proceedings of the IEEE 2017, vol. 105, no. 6, 1051–1067.
- Hoefflinger, Bernd. “ITRS: The International Technology Roadmap for Semiconductors.” In Chips 2020: A Guide to the Future of Nanoelectronics. Berlin and Heidelberg: Springer Berlin Heidelberg, 2011, 161–174.
- Chowdhury, Mostafa Zaman, Md Shahjalal, Shakil Ahmed, and Yeong Min Jang. “6G Wireless Communication Systems: Applications, Requirements, Technologies, Challenges, and Research Directions.” IEEE Open Journal of the Communications Society 2020, vol. 1, 957–975.
- Saad, Walid, Mehdi Bennis, and Mingzhe Chen. “A Vision of 6G Wireless Systems: Applications, Trends, Technologies, and Open Research Problems.” IEEE Network 2019, vol. 34, no. 3, 134–142.
- Akyildiz, Ian F., Ahan Kak, and Shuai Nie. “6G and Beyond: The Future of Wireless Communications Systems.” IEEE Access 2020, vol. 8, 133995–134030.
- Huminiuc, Teodor. “Terahertz Radiation—The Dawn of a New Information Era.” IPI Letters 2024, vol. 2, no. 1, 42–45.
- Ensoll. (2022, June 20). Silicon Wafers are the Most In-Demand Semiconductor Material - Ensoll Diamond Wire Loop - https://www.toolsresearch.com/silicon-wafers-are-the-most-in-demand-semiconductor-material/
- MarketsandMarkets, & MarketsandMarkets. (2025, March 21). Exploring the Advantages of FSO and VLC / Li-Fi in a Wireless-First Future – https://www.marketsandmarketsblog.com

IRO Journal on Sustainable Wireless Systems